? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 06/04/13 description features applications this lc03-3.3 series provides overvoltage protection for applications such as 10/100/1000 baset ethernet, and t3/e3 interfaces. this new protector combines the tvs diode element with a diode rectifer bridge to provide both longitudinal and differential protection in one package. this design results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. this reduces intermodulation (im) distortion caused by a typical solid-state protection solution. the application schematic provides the connection information and the lc03-3.3 is rated for gr-1089, intra-building transient immunity requirements for telecommunication installations. pinout functional block diagram ? lightning protection, iec61000-4-5, 150a (t p =8/20s) ? eft, iec61000-4-4, 40a (t p =5/50ns) ? low insertion loss, log- linear capacitance ? low clamping voltage ? soic-8 surface mount package (jedec ms-012) ? combined longitudinal and metallic protection ? clamping speed of nanoseconds ? ul 94v-0 epoxy molding ? rohs compliant ? t1/e1 line cards ? t3/e3 and ds3 interfaces ? sts-1 interfaces ? 10/100/1000 baset ethernet soic-8 (t op view ) 1 2 3 5 4 6 7 8 pi n 1 an d 8 pi n 4 and 5 pi n 2, 3, 6, an d 7 line out line out line in line in life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. application example this schematic shows a high-speed data interface protection solution. the lc03-3.3btg is compatible with the intra-building surge requirements of telcordias gr- 1089-core, and the basic level recommendations of itu k.20 and k.21. the telelink fuse provides overcurrent protection for the long term 50/60 hz power fault events. t elelink (0461 1 .25) lc03-3.3btg 1 2 3 4 8 7 6 5 to c hipset (ethernet phy , t3/e3 phy , etc.) rohs pb green lc03-3.3 series 3.3v 150a diode array additional information datasheet samples resources tvs diode arrays (spa ? diodes) lightning surge protection - lc03-3.3 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 06/04/13 sp03a -3.3 absolute maximum ratings parameter rating units peak pulse current (8/20s) 150 a peak pulse power (8/20s) 3300 w iec 61000-4-2, direct discharge, (level 4) 30 kv iec 61000-4-2, air discharge, (level 4) 30 kv iec 61000-4-5 (8/20s) 150 a telcordia gr 1089 (intra-building) (2/10s) 100 a itu k.20 (5/310s) 40 a electrical characteristics (t op = 25c) thermal information parameter rating units soic package 170 c/w operating temperature range C40 to 125 c storage temperature range C55 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) (soic - lead tips only) 260 c parameter symbol test conditions min typ max units reverse stand-off voltage v rwm i t 1a - - 3.3 v reverse breakdown voltage v br i t = 2a 3.3 - - v snap back voltage v sb i t = 50ma 3.3 - - v reverse leakage current i r v rwm = 3.3v, t= 25c - - 1 a clamping voltage, line-ground v c i pp = 50a, t p =8/20 s - - 13 v clamping voltage, line-ground v c i pp = 100a, t p =8/20 s - - 17 v dynamic resistance, line-ground r dyn (v c2 -v c1 )/(i pp2 -i pp1 ) - 0.15 - w clamping voltage, line-line v c i pp = 50a, t p =8/20 s - - 15 v clamping voltage, line-line v c i pp = 100a, t p =8/20 s - - 20 v dynamic resistance , line-line r dyn (v c2 -v c1 )/(i pp2 -i pp1 ) - 0.25 - w junction capacitance c j between i/o pins and ground v r =0v, f= 1mhz - 9 12 pf between i/o pins v r =0v, f= 1mhz - 4.5 6 pf caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. figure 2: current derating curve figure 1: non-repetitive peak pulse current vs. pulse time pulse deca y time (s) 1 10 10 0 1 000 11 01 00 10 00 p eak pulse cur r ent (a) pe r centa ge of rat ed cur r ent (%i p ) ambient t emper at ur e (c) 0 20 40 60 80 10 0 12 0 02 04 06 08 01 00 12 01 40 16 0 tvs diode arrays (spa ? diodes) lightning surge protection - lc03-3.3 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 06/04/13 figure 4: clamping voltage vs. peak pulse current figure 6: forward voltage vs. forward current figure 3: pulse waveform figure 5: capacitance vs. reverse voltage 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time ( s) percent of i pp li ne to gr ound li ne to li ne 0 1 2 3 4 5 6 7 8 9 10 0. 00 .5 1. 01 .5 2. 02 .5 3. 0 ca pa ci ta n ce (pf) bi as vo lt ag e (v) line to line line to gr ound 0 2 4 6 8 10 12 14 16 18 01 02 03 04 05 06 07 08 09 0 100 cl am p vo lt ag e- v c (v ) pe ak pu lse cu rre nt -i pp (a ) 0 1 2 3 4 5 6 7 01 02 03 04 05 06 07 08 09 0 100 forward current (a) forward voltage (v) ground-to-line ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p re ow condition pb ? free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 ? 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 ? 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 ? 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters tvs diode arrays (spa ? diodes) lightning surge protection - lc03-3.3 series
? 2013 littelfuse, inc. specifcations are subject to change without notice. revised: 06/04/13 sp03a -3.3 part numbering system product characteristics ordering information part number package marking min. order qty. lc03-3.3btg soic-8 lc03-3.3 2500 lead plating matte tin lead material copper alloy lead coplanarity 0.004 inches (0.102mm) substitute material silicon body material molded epoxy flammability ul 94 v-0 lc03 3.3 b t g series working voltage packag e t= tape & reel g= green ? b = soic part marking system package dimensions mechanical drawings and recommended solder pad outline package soic-8 pins 8 jedec ms-012 millimetres inches min max min max a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 a2 1.25 1.65 0.050 0.065 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 d 4.80 5.00 0.189 0.197 e 5.80 6.20 0.228 0.244 e1 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc l 0.40 1.27 0.016 0.050 o recommended soldering pad outline (reference only) f l first line: part number second line: date code f l lc03-3.3 xxxxxxxx notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. package surface matte fnish vdi 11-13. embossed carrier tape & reel specifcation soic package millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 5.4 5.6 0.213 0.22 p2 1.95 2.05 0.077 0.081 d 1. 5 1. 6 0.059 0.063 d1 1.50 min 0.059 min p0 3.9 4.1 0.154 0.161 10p0 40.0 0.20 1.574 0.008 w 11. 9 12.1 0.468 0.476 p 7. 9 8.1 0.311 0.319 a0 6.3 6.5 0.248 0.256 b0 5.1 5.3 0.2 0.209 k0 2 2.2 0.079 0.087 t 0.30 0.05 0.012 0.002 tvs diode arrays (spa ? diodes) lightning surge protection - lc03-3.3 series
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